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MC100EL17DW Datasheet(PDF) 2 Page - ON Semiconductor

Part # MC100EL17DW
Description  5V ECL Quad Differential Receiver
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EL17DW Datasheet(HTML) 2 Page - ON Semiconductor

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MC100EL17
http://onsemi.com
2
D1
Figure 1. Logic Diagram and Pinout: (Top View)
D1
D2
D3
17
18
16
15
14
13
12
4
3
5678
9
Q0
11
10
Q1
Q1
Q2
Q2
Q3
Q3
VEE
D0
19
20
2
1
VCC
Q0
D0
D2
VCC
D3
VBB
Warning: All VCC and VEE pins must be externally connected to Power
Supply to guarantee proper operation.
* All VCC pins are tied together on the die.
Table 1. PIN DESCRIPTION
FUNCTION
ECL Differential Data Inputs
ECL Differential Data Outputs
Reference Voltage Output
Positive Supply
Negative Supply
PIN
Dn, Dn
Qn, Qn
VBB
VCC
VEE
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 KW
Internal Input Pullup Resistor
75 KW
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 KV
> 200 V
> 4 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
141
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI ≤ VCC
VI ≥ VEE
6
−6
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SO−20L
SO−20L
90
60
°C/
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SO−20L
30 to 35
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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