TLV2217

LOW DROPOUT FIXEDVOLTAGE REGULATORS

SLVS067L − MARCH 1992 − REVISED APRIL 2005

2

POST OFFICE BOX 655303

description/ordering information (continued)

The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum

continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass

element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of

500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the

TLV2217 regulators offer very tight output accuracy of

±2% across operating load and temperature ranges.

Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection,

and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and

3.3 V.

absolute maximum ratings over operating virtual junction temperature range (unless otherwise

16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

package thermal data (see Note 1)

PACKAGE

BOARD

θJP‡

θJC

θJA

PowerFLEX

/TO-252 (KTP)

High K, JESD 51-5

1.4

°C/W

19

°C/W

28

°C/W

TO-220 (KC/KCS)

High K, JESD 51-5

3

°C/W

17

°C/W

19

°C/W

TSSOP (PW)

High K, JESD 51-7

32

°C/W

83

°C/W

‡ For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θJP is defined as the thermal resistance between the die

junction and the bottom of the exposed pad.

NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

recommended operating conditions

MIN

MAX

UNIT

VI

Input voltage

3.0

12

V

IO

Output current

0

500

mA

TJ

Operating virtual junction temperature range

0

125

°C

§ Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater.