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CAT93C76SATE13 Datasheet(PDF) 2 Page - Catalyst Semiconductor |
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CAT93C76SATE13 Datasheet(HTML) 2 Page - Catalyst Semiconductor |
2 / 10 page 2 CAT93C76 Doc. No. 1090, Rev. A D.C. OPERATING CHARACTERISTICS VCC = +1.8V to +5.5V, unless otherwise specified. Symbol Parameter Test Conditions Min Typ Max Units ICC1 Power Supply Current fSK = 1MHz 1 3 mA (Write) VCC = 5.0V ICC2 Power Supply Current fSK = 1MHz 300 500 µA (Read) VCC = 5.0V ISB1 Power Supply Current CS = 0V 2 10 µA (Standby) (x8 Mode) ORG=GND ISB2 Power Supply Current CS=0V 0(5) 10 µA (Standby) (x16Mode) ORG=Float or VCC ILI Input Leakage Current VIN = 0V to VCC 0(5) 10 µA ILO Output Leakage Current VOUT = 0V to VCC, CS = 0V 0(5) 10 µA ILORG ORG Pin Leakage Current ORG = GND or ORG = VCC 110 µA VIL1 Input Low Voltage 4.5V ≤ VCC ≤ 5.5V -0.1 0.8 V VIH1 Input High Voltage 4.5V ≤ VCC ≤ 5.5V 2 VCC + 1 V VIL2 Input Low Voltage 1.8V ≤ VCC < 4.5V 0 VCC x 0.2 V VIH2 Input High Voltage 1.8V ≤ VCC < 4.5V VCC x 0.7 VCC+1 V VOL1 Output Low Voltage 4.5V ≤ VCC ≤ 5.5V 0.4 V IOL = 2.1mA VOH1 Output High Voltage 4.5V ≤ VCC ≤ 5.5V 2.4 V IOH = -400 µA VOL2 Output Low Voltage 1.8V ≤ VCC < 4.5V 0.1 V IOL = 100 µA VOH2 Output High Voltage 1.8V ≤ VCC < 4.5V VCC - 0.2 V IOH = -100 µA ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias .................. -55 °C to +125°C Storage Temperature ........................ -65 °C to +150°C Voltage on any Pin with Respect to Ground(1) ............. -2.0V to +VCC +2.0V VCC with Respect to Ground ................ -2.0V to +7.0V Lead Soldering Temperature (10 secs) ............ 300 °C Output Short Circuit Current(2) ........................ 100 mA *COMMENT Stresses exceeding those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. RELIABILITY CHARACTERISTICS Symbol Parameter Reference Test Method Min Typ Max Units NEND(3) Endurance MIL-STD-883, Test Method 1033 1,000,000 Cycles/Byte TDR(3) Data Retention MIL-STD-883, Test Method 1008 100 Years VZAP(3) ESD Susceptibility MIL-STD-883, Test Method 3015 2000 Volts ILTH(3)(4) Latch-Up JEDEC Standard 17 100 mA Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns. (2) Output shorted for no more than one second. (3) These parameters are tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on I/O pins from –1V to VCC +1V. (5) 0 µA is defined as less than 900 nA. |
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