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MC100LVEL11D Datasheet(PDF) 4 Page - ON Semiconductor |
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MC100LVEL11D Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 8 page MC100LVEL11 http://onsemi.com 4 Table 6. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 8) −40°C 25°C 85°C Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit fmax Maximum Toggle Frequency 1.0 GHz tPLH tPHL Propagation Delay to Output 235 385 255 330 405 285 435 ps tSKEW Within-Device Skew (Note 9) Device−to−Device (Note 10) Duty Cycle Skew (Note 11) 5 10 20 150 20 5 10 20 150 20 5 10 20 150 20 ps tJITTER Random Clock Jitter (RMS) 0.6 ps VPP Input Swing (Note 12) 200 1000 200 1000 200 1000 mV tr tf Output Rise/Fall Times Q (20% − 80%) 120 320 120 220 320 120 320 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. VEE can vary ±0.3 V. 9. Within-device skew defined as identical transitions on similar paths through a device. 10.Device−to−device skew for identical transitions at identical VCC levels. 11. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device. 12.VPP(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV, however, AC delays may move outside of the specified range. The device has a DC gain of ≈40. Figure 2. Output Swing versus Frequency 0 200 400 600 800 0 200 400 600 800 1000 1200 1400 1600 1800 2000 f (MHz) |
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