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NUP4004M5T1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NUP4004M5T1G
Description  5?뭁in Bi?묭irectional Quad TVS Array
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NUP4004M5T1G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 0
1
Publication Order Number:
NUP4004M5/D
NUP4004M5
5−Pin Bi−Directional Quad
TVS Array
This 5−Pin bi−directional transient suppressor array is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in transient voltage and ESD sensitive equipment
such as computers, printers, cell phones, medical equipment, and other
applications. Its integrated design provides bi−directional protection
for four separate lines using a single TSOP−5 package. This device is
ideal for situations where board space is a premium.
Features
Bi−directional Protection for Four Lines in a Single TSOP−5 Package
Low Leakage Current
Low Capacitance
Provides ESD Protection for JEDEC Standards JESD22
− Machine Model = Class C
− Human Body Model = Class 3B
Provides ESD Protection for IEC 61000−4−2, 15 kV (Air),
8 kV (Contact)
This is a Pb−Free Device
Mechanical Characteristics
Void Free, Transfer−Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Applications
LCD, Plasma TV Video Lines
Other Telephone Sets
Computers / Printers / Set−Top Boxes
MAXIMUM RATINGS (TJ=25°C, unless otherwise specified)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range
TJ
−40 to
125
°C
Storage Temperature Range
TSTG
−55 to
150
°C
Lead Solder Temperature – Maximum (10 sec)
TL
260
°C
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
ESD
16
0.4
30
30
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
5
4
Device
Package
Shipping
ORDERING INFORMATION
NUP4004M5T1G
TSOP−5
(Pb−Free)
3000/Tape & Reel
3
2
1
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
http://onsemi.com
TSOP−5
CASE 483
MARKING
DIAGRAM
1
5
MY AYW
G
G
1
5
MY
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)


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