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MC100LVEL29DWR2G Datasheet(PDF) 2 Page - ON Semiconductor

Part # MC100LVEL29DWR2G
Description  3.3V ECL Dual Differential Data and Clock D Flip?묯lop With Set and Reset
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100LVEL29DWR2G Datasheet(HTML) 2 Page - ON Semiconductor

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MC100LVEL29
http://onsemi.com
2
VBB
Figure 1. Logic Diagram and Pinout: 20-Lead SOIC (Top View)
CLK0
D1 CLK1
17
18
16
15
14
13
12
4
3
5678
9
Q0
11
10
Q0
S0
S1
VCC Q1
Q1
VEE
D0
19
20
2
1
R0
VCC
CLK0
D1
D0
CLK1 R1
CLK
D
S
R
Q
Q
CLK
D
R
S
Q
Q
R
L
L
H
L
H
S
L
L
L
H
H
D
L
H
X
X
X
CLK
Z
Z
X
X
X
Q
L
H
L
H
Undef
Z = LOW to HIGH Transition
X = Don’t Care
Q
H
L
H
L
Undef
Table 1. PIN DESCRIPTION
FUNCTION
ECL Differential Data Inputs
ECL Reset Inputs
ECL Differential Clock Inputs
ECL Differential Clock Inputs
ECL Set Inputs
ECL Differential Data Outputs
Reference Voltage Output
Positive Supply
Negative Supply
PIN
D0, D0; D1, D1
R0, R1
CLK0, CLK0
CLK1, CLK1
S0, S1
Q0, Q0; Q1, Q1
VBB
VCC
VEE
Warning: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Table 2. TRUTH TABLE
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6 to 0
−6 to 0
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction to Ambient)
0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction to Case)
Standard Board
20 SOIC
30 to 35
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.


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