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CAT24FC256GLE-1.8TE13 Datasheet(PDF) 2 Page - Catalyst Semiconductor |
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CAT24FC256GLE-1.8TE13 Datasheet(HTML) 2 Page - Catalyst Semiconductor |
2 / 12 page Discontinued Part CAT24FC256 2 Doc. No. 1040, Rev. K © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias ................. –55 °C to +125°C Storage Temperature ....................... –65 °C to +150°C Voltage on Any Pin with Respect to Ground(1) ........... –2.0V to +VCC + 2.0V VCC with Respect to Ground ............... –2.0V to +7.0V Package Power Dissipation Capability (TA = 25 °C) ................................... 1.0W Lead Soldering Temperature (10 secs) ............ 300 °C Output Short Circuit Current(2) ........................ 100mA *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) These parameter are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V. (5) Maximum standby current (ISB ) = 10µA for the Automotive and Extended Automotive temperature range. Symbol Parameter Test Conditions Min Typ Max Units ICC1 Power Supply Current - Read fSCL = 100kHz 400 µA VCC = 5V ICC2 Power Supply Current - Write fSCL = 400kHz 4 mA VCC = 5V ISB(5) Standby Current VIN = GND or VCC 1 µA VCC = 5V ILI Input Leakage Current VIN = GND to VCC 1 µA ILO Output Leakage Current VOUT = GND to VCC 1 µA VIL Input Low Voltage -0.5 VCC x 0.3 V VIH Input High Voltage VCC x 0.7 VCC + 0.5 V VOL1 Output Low Voltage (VCC = +3.0 V) IOL = 3.0 mA 0.4 V VOL2 Output Low Voltage (VCC = +1.8 V) IOL = 1.5 mA 0.5 V RELIABILITY CHARACTERISTICS Symbol Parameter Reference Test Method Min Typ Max Units NEND(3) Endurance MIL-STD-883, Test Method 1033 100,000 Cycles/Byte TDR(3) Data Retention MIL-STD-883, Test Method 1008 100 Years ILTH(3)(4) Latch-up JEDEC Standard 17 100 mA CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V Symbol Test Conditions Min Typ Max Units CI/O(3) Input/Output Capacitance (SDA) VI/O = 0V 8 pF CIN(3) Input Capacitance (SCL, WP, A0, A1) VIN = 0V 6 pF DC OPERATING CHARACTERISTICS VCC = 1.8 V to 5.5 V, unless otherwise specified. |
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