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USBULC6-2F3 Datasheet(PDF) 1 Page - STMicroelectronics

Part No. USBULC6-2F3
Description  Dual ultra low capacitance protection for high speed USB
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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December 2006
Rev 1
1/8
USBULC6-2F3
IPAD™
Dual ultra low capacitance protection for high speed USB
Main application
Hi-Speed USB port in wireless handsets (up to
480 Mb/s according to USB 2.0 High Speed
Specification)
Features
Ultra low diode capacitance (1.2 pF max)
Two data lines (D+ and D-) protected against
15 kV ESD
Breakdown Voltage VBR = 6.0 V min
Flip-Chip 400 µm pitch, lead-free
Very low leakage current
Very small PCB area
RoHS compliant
Description
The USBULC6-2F3 is a monolithic, application
specific discrete device dedicated to ESD
protection of high speed interfaces.
Its ultra low line capacitance secures a high level
of signal integrity without compromizing the
protection of downstream sensitive chips against
the most stringently characterized ESD strikes.
Benefits
Minimized impact on rise and fall times for
maximum data integrity
Low PCB space occupation
Higher reliability offered by monolithic
integration
Complies with the following standards:
Pin configuration (bump side)
Configuration
Order code
TM: IPAD is a trademark of STMicroelectronics
IEC 61000-4-2:
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015.7
25 kV (Human body model)
Part Number
Marking
USBULC6-2F3
EH
Flip-Chip
(4 Bumps)
B
1
2
A
A2
A1
B2
B1
Note: B1 and B2 bumps must be
grounded on the PCB together
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