MMSZ5221BT1 Series

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6

PACKAGE DIMENSIONS

SOD−123

CASE 425−04

ISSUE E

STYLE 1:

PIN 1. CATHODE

2. ANODE

1.22

0.048

0.91

0.036

2.36

0.093

4.19

0.165

mm

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

E

b

D

A

L

C

1

2

A1

DIM

MIN

NOM

MAX

MILLIMETERS

INCHES

A

0.94

1.17

1.35

0.037

A1

0.00

0.05

0.10

0.000

b

0.51

0.61

0.71

0.020

c

1.60

0.15

0.055

D

1.40

1.80

E

2.54

2.69

2.84

0.100

−−−

3.68

0.140

L

0.25

3.86

0.010

0.046

0.002

0.024

0.063

0.106

0.145

0.053

0.004

0.028

0.071

0.112

0.152

MIN

NOM

MAX

3.56

−−−

−−−

−−−

0.006

−−−

−−−

−−−

−−−

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MMSZ5221BT1/D

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