MC33153

http://onsemi.com

2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply Voltage

20

V

Logic Input

V

Current Sense Input

V

Blanking/Desaturation Input

V

Gate Drive Output

Source Current

Sink Current

Diode Clamp Current

1.0

2.0

1.0

A

Fault Output

Source Current

Sink Current

25

10

mA

Power Dissipation and Thermal Characteristics

D Suffix SO−8 Package, Case 751

Thermal Resistance, Junction−to−Air

P Suffix DIP−8 Package, Case 626

Thermal Resistance, Junction−to−Air

0.56

180

1.0

100

W

°C/W

W

°C/W

Operating Junction Temperature

+150

°C

Operating Ambient Temperature

−40 to +105

°C

Storage Temperature Range

−65 to +150

°C

NOTE:

ESD data available upon request.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Characteristic

Symbol

Min

Typ

Max

Unit

LOGIC INPUT

Input Threshold Voltage

High State (Logic 1)

Low State (Logic 0)

−

1.2

2.70

2.30

3.2

−

V

Input Current

−

−

130

50

500

100

mA

DRIVE OUTPUT

Output Voltage

−

12

2.0

13.9

2.5

−

V

Output Pull−Down Resistor

−

100

200

k

W

FAULT OUTPUT

Output Voltage

−

12

0.2

13.3

1.0

−

V

SWITCHING CHARACTERISTICS

Logic Input to Drive Output Rise

Logic Input to Drive Output Fall

−

−

80

120

300

300

ns

−

17

55

ns

−

17

55

ns

Propagation Delay

Current Sense Input to Drive Output

Fault Blanking/Desaturation Input to Drive Output

−

0.3

1.0

ms

2. Low duty cycle pulse techniques are used during test to maintain the junction temperature as close to ambient as possible.