NB100EP223

http://onsemi.com

3

0

1

Figure 2. Logic Diagram

CLK_SEL

HSTL_CLK

HSTL_CLK

LVPECL_CLK

LVPECL_CLK

OE

Q0−Q21 (HSTL)

Q0−Q21 (HSTL)

Q

D

22

22

GND

Table 3. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

75 kW

Internal Input Pullup Resistor

37.5 kW

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 2 kV

> 150 V

> 2 kV

Moisture Sensitivity (Note 1)

Pb Pkg

Pb−Free Pkg

LQFP−64

Level 2

Level 3

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

693

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, refer to Application Note AND8003/D.

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

Core Power Supply

GND = 0 V

4

V

HSTL Output Power Supply

GND = 0 V

4

V

PECL Mode Input Voltage

GND = 0 V

4

V

Output Current

Continuous

Surge

50

100

mA

mA

Operating Temperature Range

0 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

(See Application Information)

0 lfpm

500 lfpm

64 LQFP

64 LQFP

35.6

30

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

(See Application Information)

0 lfpm

500 lfpm

64 LQFP

64 LQFP

3.2

6.4

°C/W

°C/W

Wave Solder

Pb

Pb−Free

265

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.