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BYD77 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BYD77
Description  Ultra fast low-loss controlled avalanche rectifiers
Download  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD77 Datasheet(HTML) 2 Page - NXP Semiconductors

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1999 Nov 15
2
Philips Semiconductors
Product specification
Ultra fast low-loss
controlled avalanche rectifiers
BYD77 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Shipped in 8 mm embossed tape
• Smallest surface mount
rectifier outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec
(1)
technology. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYD77A
50
V
BYD77B
100
V
BYD77C
150
V
BYD77D
200
V
BYD77E
250
V
BYD77F
300
V
BYD77G
400
V
VR
continuous reverse voltage
BYD77A
50
V
BYD77B
100
V
BYD77C
150
V
BYD77D
200
V
BYD77E
250
V
BYD77F
300
V
BYD77G
400
V
IF(AV)
average forward current
Ttp = 105 °C; see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD77A to D
2.00
A
BYD77E to G
1.85
A
IF(AV)
average forward current
Tamb =60 °C; PCB mounting (see
Fig.16); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD77A to D
0.85
A
BYD77E to G
0.80
A


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