NCP623

http://onsemi.com

2

GND

Figure 1. NCP623 Block Diagram

* Current Limit

* Antisaturation

GND

Bypass

Band Gap

Reference

ON/OFF

On/Off

Thermal

Shutdown

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply Voltage

12

V

Power Dissipation and Thermal Resistance

Maximum Power Dissipation

Internally Limited

W

Case 488AE (DFN6, 3x3) MN Suffix

Thermal Resistance, Junction−to−Air

Thermal Resistance, Junction−to−Case

Case 846A (Micro8) DM Suffix

Thermal Resistance, Junction−to−Air

Thermal Resistance, Junction−to−Case

161

13

240

105

°C/W

Operating Ambient Temperature Range

−40 to +85

°C

Maximum Junction Temperature

150

°C

Storage Temperature Range

−60 to +150

°C

ESD Protection

− Human Body Model

− Machine Model

2000

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to

which it is attached.

** Refer to the JEDEC Specs (51−2, 51−6).