NCP1117, NCV1117

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2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

20

V

Output Short Circuit Duration (Notes 2 and 3)

−

Infinite

−

Power Dissipation and Thermal Characteristics

Case 318H (SOT−223)

Power Dissipation (Note 2)

Thermal Resistance, Junction−to−Ambient, Minimum Size Pad

Thermal Resistance, Junction−to−Case

Case 369A (DPAK)

Power Dissipation (Note 2)

Thermal Resistance, Junction−to−Ambient, Minimum Size Pad

Thermal Resistance, Junction−to−Case

Internally Limited

160

15

Internally Limited

67

6.0

W

°C/W

°C/W

W

°C/W

°C/W

Maximum Die Junction Temperature Range

−55 to 150

°C

Storage Temperature Range

−65 to 150

°C

Operating Ambient Temperature Range

NCP1117

NCV1117

0 to +125

−40 to +125

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Human Body Model 2000 V per MIL−STD−883, Method 3015.

Machine Model Method 200 V.

2. Internal thermal shutdown protection limits the die temperature to approximately 175

°C. Proper heatsinking is required to prevent activation.

The maximum package power dissipation is:

PD +

TJ(max) * TA

R

qJA