Analog Integrated Circuit Device Data

Freescale Semiconductor

5

908E425

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Supply Voltage

Analog Chip Supply Voltage under Normal Operation, Steady State

Analog Chip Supply Voltage under Transient Conditions (1)

Microcontroller Chip Supply Voltage

-0.3 to 28

-0.3 to 40

-0.3 to 6.0

V

Input Pin Voltage

Analog Chip

Microcontroller Chip

-0.3 to 5.5

V

Maximum Microcontroller Current per Pin

All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1

Pins PTA0:PTA6, PTC0:PTC1

±15

±25

mA

100

mA

100

mA

LIN Supply Voltage

Normal Operation (Steady-State)

Transient Conditions (1)

-18 to 28

40

V

ESD Voltage (2)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

±3000

±150

±500

V

THERMAL RATINGS

Storage Temperature

–

°C

Ambient Operating Temperature

0 to 85

°C

Operating Case Temperature (3)

0 to 85

°C

Operating Junction Temperature (4)

0 to 125

°C

Peak Package Reflow Temperature During Solder Mounting (5)

245

°C

Notes

1.

Transient capability for pulses with a time of t < 0.5 sec.

2.

3.

The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

4.

The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.

5.

Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.