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NCP5010 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP5010 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 18 page NCP5010 http://onsemi.com 3 MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage (Note 2) VIN 7.0 V Over Voltage Protection VOUT 24 V Human Body Model (HBM) ESD Rating (Note 3) ESD HBM 2000 V Machine Model (MM) ESD Rating (Note 3) ESD MM 200 V Digital Input Voltage Digital Input Current CTRL −0.3 < VIN < Vbat+0.3 1.0 V mA Power Dissipation @ TA = +85 °C PD 150 mW Thermal Resistance Junction−to−Air 8−Pin Flip−Chip Package RqJA (Note 6) °C/W Operating Ambient Temperature Range TA −40 to +85 °C Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 2. According to JEDEC standard JESD22−A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins. 4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 6. For the 8−Pin Flip−Chip CSP Package, the RqJA is highly dependent on the PCB Heatsink area. For example RqJA can be to 195°C/W with 50 mm total area and also 135 °C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing the power dissipation. |
Similar Part No. - NCP5010_06 |
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Similar Description - NCP5010_06 |
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