NCV4274, NCV4274A

http://onsemi.com

2

Figure 1. Block Diagram

−

+

Bandgap

Refernece

Thermal

Shutdown

Current Limit and

Saturation Sense

GND

Q

I

Pin Definitions and Functions

Pin No.

Symbol

Function

1

I

Input; Bypass directly at the IC a ceramic capacitor to GND.

2,4

GND

Ground

3

Q

Output; Bypass with a capacitor to GND.

1. DPAK 3LD package code 6025

2. D2PAK 3LD package code 6083

ABSOLUTE MAXIMUM RATINGS

Pin Symbol, Parameter

Symbol

Condition

Min

Max

Unit

I, Input−to−Regulator

Voltage

−42

45

V

Current

Internally

Limited

Internally

Limited

I, Input peak Transient Voltage to Regulator with Respect

to GND

60

V

Q, Regulated Output

Voltage

−1.0

40

V

Current

Internally

Limited

Internally

Limited

GND, Ground Current

−

100

mA

Junction Temperature

Storage Temperature

−

−50

150

150

°C

°C

ESD Capability, Human Body Model

4

kV

ESD Capability, Machine Model

200

V

ESD Capability, Charged Device Model

1

kV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

3. This device series incorporates ESD protection and is tested by the following methods:

ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model