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NCV4276DS50G Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV4276DS50G Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 23 page NCV4276, NCV4276A http://onsemi.com 3 PIN FUNCTION DESCRIPTION Pin No. Symbol Description 1 I Input; Battery Supply Input Voltage. 2 INH Inhibit; Set low−to inhibit. 3 GND Ground; Pin 3 internally connected to heatsink. 4 NC / VA Not connected for fixed voltage version / Voltage Adjust Input for adjustable voltage version; use an external voltage divider to set the output voltage 5 Q Use 22 mF, ESR < 2.5 W at 10 kHz to ground with the 5.0 V and adjustable regulators. See Figures 3, 4, and 5. Use 10 mF, ESR < 1.8 W at 10 kHz to ground with the 3.3 V, 2.5 V, and 1.8 V regulators. See Figures 3 and 6. MAXIMUM RATINGS* Rating Symbol Min Max Unit Input Voltage VI −42 45 V Input Peak Transient Voltage VI − 45 V Inhibit INH Voltage VINH −42 45 V Output Voltage VQ −1.0 40 V Ground Current Iq − 100 mA Input Voltage Operating Range VI VQ + 0.5 V or 4.5 V (Note 1) 40 V ESD Susceptibility (Human Body Model) (Machine Model) (Charged Device Model) − − − 4.5 250 1.25 − − − kV V kV Junction Temperature TJ −40 150 °C Storage Temperature Tstg −50 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal dissipation must be observed closely. LEAD TEMPERATURE SOLDERING REFLOW (Note 2) Lead Temperature Soldering Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak Reflow (SMD styles only), Lead Free, 60−150 s above 217, 40 s max at peak Wave Solder (through hole styles only), 12 sec max TSLD − − − 240 265 310 °C THERMAL CHARACTERISTICS Characteristic Test Conditions (Typical Value) Unit DPAK 5−PIN PACKAGE Min Pad Board (Note 3) 1, Pad Board (Note 4) Junction−to−Tab (psi−JLx, yJLx) 4.2 4.7 C/W Junction−to−Ambient (RqJA, qJA) 100.9 46.8 C/W D2PAK 5−PIN PACKAGE 0.4 sq. in. Spreader Board (Note 5) 1.2 sq. in. Spreader Board (Note 6) Junction−to−Tab (psi−JLx, yJLx) 3.8 4.0 C/W Junction−to−Ambient (RqJA, qJA) 74.8 41.6 C/W 1. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher. 2. Per IPC / JEDEC J−STD−020C. 3. 1 oz. copper, 0.26 inch2 (168 mm2) copper area, 0.062″ thick FR4. 4. 1 oz. copper, 1.14 inch2 (736 mm2) copper area, 0.062″ thick FR4. 5. 1 oz. copper, 0.373 inch2 (241 mm2) copper area, 0.062″ thick FR4. 6. 1 oz. copper, 1.222 inch2 (788 mm2) copper area, 0.062″ thick FR4. |
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