NCV4276DS50G datasheet(3/23 Pages) ONSEMI

Part #	NCV4276DS50G

Description	400 mA Low?묭rop Voltage Regulator

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Manufacturer	ONSEMI [ON Semiconductor]

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NCV4276, NCV4276A

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PIN FUNCTION DESCRIPTION

Pin No.

Symbol

Description

1

I

Input; Battery Supply Input Voltage.

2

INH

Inhibit; Set low−to inhibit.

3

GND

Ground; Pin 3 internally connected to heatsink.

4

NC / VA

Not connected for fixed voltage version / Voltage Adjust Input for adjustable voltage version; use an external

voltage divider to set the output voltage

5

Q

Use 22 mF, ESR < 2.5 W at 10 kHz to ground with the 5.0 V and adjustable regulators. See Figures 3, 4, and 5.

Use 10 mF, ESR < 1.8 W at 10 kHz to ground with the 3.3 V, 2.5 V, and 1.8 V regulators. See Figures 3 and 6.

MAXIMUM RATINGS*

Rating

Symbol

Min

Max

Unit

Input Voltage

VI

−42

45

V

Input Peak Transient Voltage

VI

−

45

V

Inhibit INH Voltage

VINH

−42

45

V

Output Voltage

VQ

−1.0

40

V

Ground Current

Iq

−

100

mA

Input Voltage Operating Range

VI

VQ + 0.5 V or 4.5 V

(Note 1)

40

V

ESD Susceptibility

(Human Body Model)

(Machine Model)

(Charged Device Model)

−

4.5

250

1.25

−

kV

V

kV

Junction Temperature

TJ

−40

150

°C

Storage Temperature

Tstg

−50

150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal

dissipation must be observed closely.

LEAD TEMPERATURE SOLDERING REFLOW (Note 2)

Lead Temperature Soldering

Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak

Reflow (SMD styles only), Lead Free, 60−150 s above 217, 40 s max at peak

Wave Solder (through hole styles only), 12 sec max

TSLD

−

240

265

310

°C

THERMAL CHARACTERISTICS

Characteristic

Test Conditions (Typical Value)

Unit

DPAK 5−PIN PACKAGE

Min Pad Board (Note 3)

1, Pad Board (Note 4)

Junction−to−Tab (psi−JLx, yJLx)

4.2

4.7

C/W

Junction−to−Ambient (RqJA, qJA)

100.9

46.8

C/W

D2PAK 5−PIN PACKAGE

0.4 sq. in. Spreader Board (Note 5)

1.2 sq. in. Spreader Board (Note 6)

Junction−to−Tab (psi−JLx, yJLx)

3.8

4.0

C/W

Junction−to−Ambient (RqJA, qJA)

74.8

41.6

C/W

1. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher.

2. Per IPC / JEDEC J−STD−020C.

3. 1 oz. copper, 0.26 inch2 (168 mm2) copper area, 0.062″ thick FR4.

4. 1 oz. copper, 1.14 inch2 (736 mm2) copper area, 0.062″ thick FR4.

5. 1 oz. copper, 0.373 inch2 (241 mm2) copper area, 0.062″ thick FR4.

6. 1 oz. copper, 1.222 inch2 (788 mm2) copper area, 0.062″ thick FR4.

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