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NE570DR2G Datasheet(PDF) 1 Page - ON Semiconductor |
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NE570DR2G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 10 page © Semiconductor Components Industries, LLC, 2006 May, 2006 − Rev. 4 1 Publication Order Number: NE570/D NE570 Compandor The NE570 is a versatile low cost dual gain control circuit in which either channel may be used as a dynamic range compressor or expandor. Each channel has a full−wave rectifier to detect the average value of the signal, a linerarized temperature−compensated variable gain cell, and an operational amplifier. The NE570 is well suited for use in cellular radio and radio communications systems, modems, telephone, and satellite broadcast/receive audio systems. Features • Complete Compressor and Expandor in One IC • Temperature Compensated • Greater than 110 dB Dynamic Range • Operates Down to 6.0 VDC • System Levels Adjustable with External Components • Distortion may be Trimmed Out • Pb−Free Packages are Available* Applications • Cellular Radio • Telephone Trunk Comandor • High Level Limiter • Low Level Expandor − Noise Gate • Dynamic Noise Reduction Systems • Voltage−Controlled Amplifier • Dynamic Filters MAXIMUM RATINGS Rating Symbol Value Unit Maximum Operating Voltage VCC 24 VDC Operating Ambient Temperature Range TA 0 to +70 °C Operating Junction Temperature TJ 150 °C Power Dissipation PD 400 mW Thermal Resistance, Junction−to−Ambient RqJA 105 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. DG CELL IN RECT IN VREF 1.8 V THD TRIM RECT CAP INVERTER IN OUTPUT + − R2 20 kW R1 10 kW VARIABLE GAIN 30 k W 20 k W Figure 1. Block Diagram RECTIFIER R3 R3 R4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com PIN CONNECTIONS See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. ORDERING INFORMATION (Top View) SOIC−16 WB D SUFFIX CASE 751G RECT_IN_1 RECT_CAP_2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 15 RECT_CAP_1 DG_CELL_IN_1 INV_IN_1 GND RES_R3_1 OUTPUT_1 THD_TRIM_1 RECT_IN_2 DG_CELL_IN_2 VCC INV_IN_2 RES_R3_2 OUTPUT_2 THD_TRIM_2 1 MARKING DIAGRAM 16 1 NE570D AWLYYWWG A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package Plastic Small Outline Package; 16 Leads; Body Width 7.5 mm |
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