NID5001N

http://onsemi.com

5

PACKAGE DIMENSIONS

DPAK

CASE 369C−01

ISSUE O

D

A

K

B

R

V

S

F

L

G

2 PL

M

0.13 (0.005)

T

E

C

U

J

H

PLANE

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.22

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.018

0.023

0.46

0.58

F

0.037

0.045

0.94

1.14

G

0.180 BSC

4.58 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.090 BSC

2.29 BSC

R

0.180

0.215

4.57

5.45

S

0.025

0.040

0.63

1.01

U

0.020

−−−

0.51

−−−

V

0.035

0.050

0.89

1.27

Z

0.155

−−−

3.93

−−−

12

3

4

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

ON Semiconductor and

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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