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NSBA1XXXDXV6T1G Datasheet(PDF) 1 Page - ON Semiconductor |
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NSBA1XXXDXV6T1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 11 page © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 6 1 Publication Order Number: NSBA114EDXV6/D NSBA114EDXV6T1, NSBA114EDXV6T5 SERIES Preferred Devices Dual Bias Resistor Transistors PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base−emitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. In the NSBA114EDXV6T1 series, two BRT devices are housed in the SOT−563 package which is ideal for low−power surface mount applications where board space is at a premium. Features • Simplifies Circuit Design • Reduces Board Space • Reduces Component Count • These are Pb−Free Devices MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1 and Q2) Rating Symbol Value Unit Collector-Base Voltage VCBO −50 Vdc Collector-Emitter Voltage VCEO −50 Vdc Collector Current IC −100 mAdc THERMAL CHARACTERISTICS Characteristic (One Junction Heated) Symbol Max Unit Total Device Dissipation @ TA = 25°C Derate above 25 °C (Note 1) PD 357 2.9 mW mW/ °C Thermal Resistance, Junction-to-Ambient (Note 1) RqJA 350 °C/W Characteristic (Both Junctions Heated) Symbol Max Unit Total Device Dissipation @ TA = 25°C Derate above 25 °C (Note 1) PD 500 4.0 mW mW/ °C Thermal Resistance, Junction-to-Ambient (Note 1) RqJA 250 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 @ Minimum Pad Preferred devices are recommended choices for future use and best overall value. DEVICE MARKING INFORMATION See specific marking information in the device marking table on page 2 of this data sheet. Q1 R1 R2 R2 R1 Q2 (1) (2) (3) (4) (5) (6) SOT−563 CASE 463A PLASTIC STYLE 1 1 MARKING DIAGRAM xx M G G http://onsemi.com Device Package Shipping† ORDERING INFORMATION NSBA1xxxDXV6T1 SOT−563* 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. xx = Device Code (Refer to page 2) M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) NSBA1xxxDXV6T1G SOT−563* 4000/Tape & Reel NSBA1xxxDXV6T5 SOT−563* 8000/Tape & Reel NSBA1xxxDXV6T5G SOT−563* 8000/Tape & Reel **This package is inherently Pb−Free. |
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