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SY100E122JY Datasheet(PDF) 3 Page - Micrel Semiconductor

Part # SY100E122JY
Description  9-BIT BUFFER
Download  4 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

SY100E122JY Datasheet(HTML) 3 Page - Micrel Semiconductor

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SY10E122
SY100E122
Micrel, Inc.
M9999-032006
hbwhelp@micrel.com or (408) 955-1690
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = –40
°CTA = 0°CTA = +25°CTA = +85°C
Symbol
Parameter
Min.
Typ. Max. Min.
Typ. Max. Min.
Typ. Max. Min.
Typ.
Max.
Unit
tPD
Propagation Delay to
150
350
500
150
350
500
150
350
500
150
350
500
ps
D to Q
tskew
Within-Device Skew
—
75
—
—
75
—
—
75
—
—
75
—
ps
D to Q(1)
tr
Rise/Fall Time
300
425
800
300
425
800
300
425
800
300
425
800
ps
tf
20% to 80%
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = –40
°CTA = 0°CTA = +25°CTA = +85°C
Symbol
Parameter
Min.
Typ. Max. Min.
Typ.
Max. Min.
Typ.
Max. Min.
Typ.
Max.
Unit
IIH
Input HIGH Current
—
—
200
—
—
200
—
—
200
—
—
200
µA
IEE
Power Supply Current
mA
10E
—
41
49
—
41
49
—
41
49
—
41
49
100E
—
41
49
—
41
49
—
41
49
—
47
57
DC ELECTRICAL CHARACTERISTICS
AC ELECTRICAL CHARACTERISTICS
Note:
1. Within-device skew is defined as identical transitions on similar paths through a device.


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