3

SY89543L

Micrel, Inc.

M9999-071505

hbwhelp@micrel.com or (408) 955-1690

Input Current

Source or sink current on IN, /IN ..........................

±50mA

Lead Temperature (soldering, 20 sec.) ................... +260

°C

MLF™ (

θ

Still-Air ................................................................ 35

°C/W

500lfpm .............................................................. 28

°C/W

MLF™ (

ψ

Junction-to-Board ............................................... 20

°C/W

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

3.0

3.3

3.6

V

Power Supply Current

(6)

66

88

mA

Differential Input Resistance

80

100

120

Ω

(IN-to-/IN)

Input Resistance

40

50

60

Ω

(IN-to-VT, /IN-to-VT)

Input High Voltage (IN, /IN)

Note 7

V

Input Low Voltage (IN, /IN)

Note 7

V

Input Voltage Swing (IN, /IN)

Notes 7, 8

100

mV

Differential Input Voltage Swing

Notes 7, 8

200

2

×V

CC

mV

|IN - /IN|

1.8

V

Notes:

1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions

for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Due to the limited drive capability use for input of the same package only.

4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

Ψ

θ

5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

6. Includes current through internal 50

Ω pull-ups.