3

SY89824L

Micrel, Inc.

M9999-020207

hbwhelp@micrel.com or (408) 955-1690

CLK_SEL

0

0

LOW

HIGH

0

1

LOW

HIGH

1

0

HSTL_CLK

/HSTL_CLK

1

1

LVPECL_CLK

/LVPECL_CLK

TRUTH TABLE

NOTE:

1. The OE (output enable) signal is synchronized with the low level of the

HSTL_CLK and LVPECL_CLK signal.

Level

Direction

Signal

HSTL

Input

HSTL_CLK, /HSTL_CLK

HSTL

Output

LVPECL

Input

LVPECL_CLK, /LVPECL_CLK

LVCMOS/LVTTL

Input

CLK_SEL, OE

SIGNAL GROUPS

Symbol

Rating

Value

Unit

V

–0.5 to +4.0

V

Input Voltage

–0.5 to V

CCI

V

DC Output Current (Output HIGH)

–50

mA

Lead Temperature (soldering, 20sec.)

260

°C

Storage Temperature

–65 to +150

°C

θ

JA

Package Thermal Resistance (Junction-to-Ambient)

With Die attach soldered to GND:

–Still-Air (TQFP)

23

°C/W

–200lfpm (TQFP)

18

°C/W

–500lfpm (TQFP)

15

°C/W

With Die attach NOT soldered to GND:

–Still-Air (TQFP)

44

°C/W

–200lfpm (TQFP)

36

°C/W

–500lfpm (TQFP)

30

°C/W

θ

JC

Package Thermal Resistance

4.3

°C/W

(Junction-to-Case)

NOTE:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data book. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.