PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

BUF634F

OBSOLETE

DDPAK/

TO-263

KTT

5

TBD

Call TI

Call TI

BUF634F/500

ACTIVE

DDPAK/

TO-263

KTT

5

500

Pb-Free

(RoHS)

CU SN

Level-2-260C-1 YEAR

BUF634F/500E3

ACTIVE

DDPAK/

TO-263

KTT

5

500

Pb-Free

(RoHS)

CU SN

Level-2-260C-1 YEAR

BUF634FKTTT

ACTIVE

DDPAK/

TO-263

KTT

5

50

Pb-Free

(RoHS)

CU SN

Level-2-260C-1 YEAR

BUF634FKTTTE3

ACTIVE

DDPAK/

TO-263

KTT

5

50

Pb-Free

(RoHS)

CU SN

Level-2-260C-1 YEAR

BUF634P

ACTIVE

PDIP

P

8

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

N / A for Pkg Type

BUF634PG4

ACTIVE

PDIP

P

8

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

N / A for Pkg Type

BUF634T

ACTIVE

TO-220

KC

5

49

Green (RoHS &

no Sb/Br)

Call TI

N / A for Pkg Type

BUF634TG3

ACTIVE

TO-220

KC

5

49

Green (RoHS &

no Sb/Br)

Call TI

N / A for Pkg Type

BUF634U

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

BUF634U/2K5

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

BUF634U/2K5E4

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

BUF634UE4

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

PACKAGE OPTION ADDENDUM

www.ti.com

29-Jan-2007

Addendum-Page 1