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HIP1030AS Datasheet(PDF) 3 Page - Intersil Corporation |
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HIP1030AS Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 7 page 3 Absolute Maximum Ratings Thermal Information Maximum Supply Voltage VCC. . .See O.V. Shutdown Limit, VOVSD Input Voltage, VIN (Note 1). . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V) Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . . Internal Limiting Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . ±60VPEAK Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W) Plastic SIP Package . . . . . . . . . . . . . . 50 4 Maximum Power Dissipation (Note 3) At TA = 125 oC, Infinite Heat Sink . . . . . . . . . . . . . . . . . . . . 6.25W Maximum Junction Temperature, TJ. . . . . . . . . . . . . . . . . . . . 150 oC Maximum Storage Temperature Range . . . . . . . . . . -40oC to 150oC Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC (Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Input Control Voltage, VIN shall not be greater than (VCC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V. 2. θJA is measured with the component mounted on an evaluation PC board in free air. 3. The worst case thermal resistance, θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction temperature rise due to dissipation is: PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT) TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink. Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal resistance, θJC + θHS. For example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink, the junction-to-air thermal resistance, θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree from TAMB to the maximum rated junction temperature of 150 oC. If T AMB = 100 oC, the maximum P D is (150 - 100) x 0.1W/ oC = 5W. Electrical Specifications TA = -40 oC to 125oC, V IN = 2V, VCC = +12V, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Operating Voltage Range VCC 4.5 - 25 V Over-Voltage Shutdown VOVSD RL = 1KΩ; VIN = 2V 26 33 38 V Over-Temperature Limiting TSD -150 - oC Negative Pulse Output Clamp Voltage VCL ICL = -100mA; VCC = 4.5V to 25V (VCC - 35) (VCC - 30.5) (VCC - 28) V Short Circuit Current Limiting ISC (Note 4) 1.1 1.6 2.5 A Input Control ON VIH 2.0 - - V Input Control OFF VIL -- 0.8 V Input Current High IIH VIN = 5.5V, VCC = 6V to 24V 6 - 40 µA Input Current Low IIL VIN = 0.8V, VCC = 6V to 24V 6 - 30 µA Supply Current, Full Load Input Control ON ICCMAX VIN = 2V; IOUT = 1.0A; - 1.05 1.1 A Supply Current, No Load Input Control OFF ICCMIN VIN = 0V; IOUT = 0A; - 55 100 µA Input-Output Forward Voltage Drop (VCC - VOUT) VSAT IOUT = 1A; VCC = 4.5V to 25V - 0.6 1 V Output Leakage IOUT_LK VIN = 0.8V; VCC = 6V to 24V - 4 50 µA Turn ON Time tON RL = 80Ω; (Note 5) - 5 20 µs Turn OFF Time tOFF RL = 80Ω; (Note 5) - 25 65 µs NOTES: 4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse. See Figure 7. 5. Refer to Figures 3A and 3B for typical switching speeds with a 20 Ω Load. HIP1030 |
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