10

Thermal Information

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.0V

ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Operating Conditions

Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V

Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

Thermal Resistance (Typical, Note 1)

PLCC Package. . . . . . . . . . . . . . . . . . .

36

N/A

Maximum Junction Temperature

PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C

Lead Temperature (Soldering, 10s). . . . . . . . . . . . . . . . . . . . . 300°C

Die Characteristics

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1.

θ

DC Electrical Specifications

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

MAX

UNITS

Logical One Input Voltage

2.0

-

V

Logical Zero Input Voltage

-

0.8

V

High Level Clock Input

3.0

-

V

Low Level Clock Input

-

0.8

V

Output HIGH Voltage

2.6

-

V

Output LOW Voltage

-

0.4

V

Input Leakage Current

-10

10

µA

I/O Leakage Current

-10

10

µA

Standby Power Supply Current

-

500

µA

Operating Power Supply Current

-

180

mA

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

MAX

UNITS

Input Capacitance

measurements are referenced to device

ground

-

10

pF

Output Capacitance

-

10

pF

NOTES:

3. Not tested, but characterized at initial design and at major process/design changes.

HSP45106