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LM567H Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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LM567H Datasheet(HTML) 9 Page - National Semiconductor (TI) |
9 / 12 page LM567C MDC MWC TONE DECODER 00697523 Die Layout (C - Step) DIE/WAFER CHARACTERISTICS Fabrication Attributes General Die Information Physical Die Identification LM567C Bond Pad Opening Size (min) 91µm x 91µm Die Step C Bond Pad Metalization 0.5% COPPER_BAL. ALUMINUM Physical Attributes Passivation VOM NITRIDE Wafer Diameter 150mm Back Side Metal BARE BACK Dise Size (Drawn) 1600µm x 1626µm 63.0mils x 64.0mils Back Side Connection Floating Thickness 406µm Nominal Min Pitch 198µm Nominal Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (C - Step) (Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE XYX Y OUTPUT FILTER 1 -673 686 91 x 91 LOOP FILTER 2 -673 -419 91 x 91 INPUT 3 -673 -686 91 x 91 V+ 4 -356 -686 91 x 91 TIMING RES 5 673 -122 91 x 91 TIMING CAP 6 673 76 91 x 91 GND 7 178 686 117 x 91 OUTPUT 8 -318 679 117 x 104 www.national.com 9 |
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