MAX211

5V MULTICHANNEL RS232 LINE DRIVER/RECEIVER

WITH ±15kV ESD PROTECTION

SLLS567E − MAY 2003 − REVISED JANUARY 2004

1

POST OFFICE BOX 655303

±15 kV Using Human-Body Model (HBM)

TIA/EIA-232-F and ITU v.28 Standards

Mode ...1

µA Typical

JESD 78, Class II

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX211 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with

±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the

requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication

controller and the serial-port connector. The charge pump and four small external capacitors allow operation

from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/

µs

driver output slew rate.

The MAX211 has both shutdown (SHDN) and enable control (EN). In shutdown mode, the charge pumps are

reduces supply current typically to 1

µA. EN is used to put the receiver outputs into the high-impedance state

to allow wired-OR connection of two RS-232 ports. It has no effect on the RS-232 drivers or the charge pumps.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (DW)

Tube of 20

MAX211CDW

MAX211C

0

°C to 70°C

SOIC (DW)

Reel of 1000

MAX211CDWR

MAX211C

0

°C to 70°C

SSOP (DB)

Tube of 50

MAX211CDB

MAX211C

SSOP (DB)

Reel of 2000

MAX211CDBR

MAX211C

SOIC (DW)

Tube of 20

MAX211IDW

MAX211I

−40

°C to 85°C

SOIC (DW)

Reel of 1000

MAX211IDWR

MAX211I

−40

°C to 85°C

SSOP (DB)

Tube of 50

MAX211IDB

MAX211I

SSOP (DB)

Reel of 2000

MAX211IDBR

MAX211I

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Copyright

 2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DB OR DW PACKAGE

(TOP VIEW)

DOUT3

DOUT1

DOUT2

RIN2

ROUT2

DIN2

DIN1

ROUT1

RIN1

GND

C1+

V+

C1−

DOUT4

RIN3

ROUT3

SHDN

EN

RIN4

ROUT4

DIN4

DIN3

ROUT5

RIN5

V−

C2−

C2+

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.