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SN75C3232PWR Datasheet(PDF) 1 Page - Texas Instruments |
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SN75C3232PWR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 14 page SN65C3232, SN75C3232 3V TO 5.5V MULTICHANNEL RS232 COMPATIBLE LINE DRIVER/RECEIVER SLLS540B − JULY 2002 − REVISED NOVEMBER 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Operate With 3-V to 5.5-V VCC Supply D Operate Up To 1 Mbit/s D Low Supply Current . . . 300 µA Typ D External Capacitors ...4 × 0.1 µF D Accept 5-V Logic Input With 3.3-V Supply D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) D Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment description/ordering information The SN65C3232 and SN75C3232 consist of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). These devices provide the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/ µs to 150 V/µs. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC − D Tube of 40 SN65C3232D 65C3232 SOIC − D Reel of 2500 SN65C3232DR 65C3232 SOIC − DW Tube of 40 SN65C3232DW 65C3232 −40 °C to 85°C SOIC − DW Reel of 2000 SN65C3232DWR 65C3232 −40 C to 85 C SSOP − DB Reel of 2000 SN65C3232DBR 65C3232 TSSOP − PW Tube of 90 SN65C3232PW CB3232 TSSOP − PW Reel of 2000 SN65C3232PWR CB3232 SOIC − D Tube of 40 SN75C3232D 75C3232 SOIC − D Reel of 2500 SN75C3232DR 75C3232 SOIC − DW Tube of 40 SN75C3232DW 75C3232 0 °C to 70°C SOIC − DW Reel of 2000 SN75C3232DWR 75C3232 0 C to 70 C SSOP − DB Reel of 2000 SN75C3232DBR 75C3232 TSSOP − PW Tube of 90 SN75C3232PW CA3232 TSSOP − PW Reel of 2000 SN75C3232PWR CA3232 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. D, DB, DW, OR PW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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