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TRF7960RHBT Datasheet(PDF) 3 Page - Texas Instruments |
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TRF7960RHBT Datasheet(HTML) 3 Page - Texas Instruments |
3 / 7 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS TABLE PER PACKAGE RECOMMENDED OPERATING CONDITIONS TRF7960/61 SLOS504B – AUGUST 2006 – REVISED APRIL 2007 over operating free-air temperature range (unless otherwise noted)(1) VALUE UNIT VIN Supply voltage 6 V IO Output current 150 mA Continuous power dissipation See Dissipation Rating Table Maximum junction temperature, any condition(2) 140 °C TJ Maximum junction temperature, continuous operation, long-term reliability(2) 125 °C Tstg Storage temperature range –55 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C HBM (human body model) 2 kV ESDS rating CDM (charged device model) 500 V MM (machine model) 200 (1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those specified are not implied. (2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. TABLE 5. PACKAGING/ORDERING INFORMATION(1) PACKAGED DEVICES PACKAGE TYPE TRANSPORT MEDIA QUANTITY TRF7960RHBT Tape and reel 250 RHB-32 TRF7960RHBR Tape and reel 3000 TRF7961RHBT Tape and reel 250 RHB-32 TRF7961RHBR Tape and reel 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. POWER RATING(2) θ JC θ JA (1) PACKAGE ( °C/W) ( °C/W) TA≤ 25°C TA = 85°C RHB (32) 31 36.4 2.7 W 1.1 W (1) This data was taken using the JEDEC standard high-K test PCB. (2) Power rating is determined with a junction temperature of 125 °C. This is the point where distortion starts to increase substantially. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long-term reliability. over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Supply voltage 2.7 5 5.5 V TJ Operating virtual junction temperature range –40 125 °C TA Operating ambient temperature range –40 25 110 °C Load impedance at TX OUT (pin 5) 10 Ω 3 Submit Documentation Feedback |
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