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CP82C89Z Datasheet(PDF) 10 Page - Intersil Corporation |
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CP82C89Z Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 13 page 10 FN2980.2 February 27, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Operating Conditions Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Operating Temperature Range C82C89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C M82C89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C Thermal Resistance (Note 1) θJA (°C/W) θJC (°C/W) CERDIP Package. . . . . . . . . . . . . . . . . 80 20 PDIP Package* . . . . . . . . . . . . . . . . . . 75 N/A Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Maximum Junction Temperature Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Die Characteristics Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200 Gates CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. DC Electrical Specifications VCC = 5.0V ± 10%; TA = 0°C to +70°C (C82C89); TA = -55°C to +125°C (M82C89) SYMBOL PARAMETER TEST CONDITIONS MIN MAX UNITS VIH Logical One Input Voltage C82C89, M82C89, Note 1 2.0 2.2 - - V V VIL Logical Zero Input Voltage Note 1 - 0.8 V VIHC CLK Logical One Input Voltage 0.7 VCC - V VILC CLK Logical Zero Input Voltage - 0.2 VCC V VOL Output Low Voltage BUSY, CBRQ IOL = 20mA - 0.45 V AEN IOL = 16mA - 0.45 V BPRO, BREQ IOL = 8mA - 0.45 V VOH1 Output High Voltage BUSY, CBRQ Open-Drain VOH2 Output High Voltage IOH = -2.5mA 3.0 - V All Other Outputs IOH = -100µAVCC -0.4 - V II Input Leakage Current VIN = GND or VCC, DIP Pins 1-6, 9, 14-19 -1.0 1.0 µA IO I/O Leakage VO = GND or VCC, DIP Pins 11-12 -10.0 10.0 µA ICCSB Standby Power Supply VCC = 5.5V, VIN = VCC or GND, Outputs Open - 10 µA ICCOP Operating Power Supply Current VCC = 5.5V, Outputs Open, Note 2 - 1 mA/MHz NOTES: 1. Does not apply to IOB, RESB, or ANYRQST. These are strap options and should be held to VCC or GND. 2. Maximum current defined by CLK or BCLK, whichever has the highest operating frequency Capacitance TA = +25°C SYMBOL PARAMETER TEST CONDITIONS TYPICAL UNITS CIN Input Capacitance FREQ = 1MHz, all measurements are referenced to device GND 10 pF COUT Output Capacitance 10 pF CIO I/O Capacitance 15 pF 82C89 |
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