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AP1122DG-13 Datasheet(PDF) 4 Page - Diodes Incorporated |
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AP1122DG-13 Datasheet(HTML) 4 Page - Diodes Incorporated |
4 / 9 page AP1122 1A LOW DROPOUT POSITIVE REGULATOR AP1122 Rev. 2 4 of 9 FEBRUARY 2007 www.diodes.com © Diodes Incorporated Electrical Characteristics (Under Operating Conditions) PARAMETER CONDITIONS MIN TYP MAX UNIT Output Voltage 2.5V≦VIN≦12V, TA=25 oC 1.176 1.2 1.224 V Line Regulation IO=10mA, 2.5V<VIN<12V, TA=25 oC 0.2 % Load Regulation VIN=2.5V~12V,Vadj=0,0mA<Io<1A, TA=25 oC (Note 4,5) 1 % Dropout Voltage (VIN-VOUT) IOUT = 1A ,∆VOUT=0.1%VOUT 1.3 1.4 V Current Limit (VIN-VOUT) = 5V 1. 1 A Minimum Load Current (Note 6) 0 oC≦Tj≦125oC 5 10 mA Thermal Regulation TA=25 oC, 30ms pulse 0.008 0.04 %/W Ripple Rejection F=120Hz,COUT=25uF Tantalum, IOUT=1A, VIN=VOUT+3V 60 70 dB Temperature Stability IO=10mA 0.5 % JA θ Thermal Resistance Junction-to-Ambient SOT89-3L : Control Circuitry/Power Transistor (Note 7) SOT223-3L : Control Circuitry/Power Transistor (Note 8) TO252-3L : Control Circuitry/Power Transistor (Note 9) 182 107 73 oC/W JC θ Thermal Resistance Junction-to-Case SOT89-3L : Control Circuitry/Power Transistor (Note 7) SOT223-3L : Control Circuitry/Power Transistor (Note 8) TO252-3L : Control Circuitry/Power Transistor (Note 9) 42 12 16 oC/W Note: 4. See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead = 1/18” from the package. 5. Line and load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the difference between input and output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. 6. Quiescent current is defined as the minimum output current required in maintaining regulation. At 12V input/output differential the device is guaranteed to regulate if the output current is greater than 10mA. 7. Test condition for SOT89-3L: no air flow, no heat sink. 8. Test condition for SOT223-3L: TA = 27°C, no air flow, device mounted on 2”X2” polyimide PCB, 2 oz copper, 5.6mmX5.6mm pad. 9. Test condition for TO252-3L: TA = 27°C, no air flow, device mounted on 2”X2” polyimide PCB, 1 oz copper, 2cmX2cm pad. |
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