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HCS32K Datasheet(PDF) 1 Page - Intersil Corporation |
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HCS32K Datasheet(HTML) 1 Page - Intersil Corporation |
1 / 11 page 1 ® FN3057.1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1995, 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HCS32MS Radiation Hardened Quad 2-Input OR Gate The Intersil HCS32MS is a Radiation Hardened Quad 2-Input OR Gate. A low on both inputs forces the output to a low state. The HCS32MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS Logic Family. The HCS32MS is supplied in a 14 Ld Ceramic flatpack (K suffix) or a SBDIP Package (D suffix). Features • 3 Micron Radiation Hardened SOS CMOS • Total Dose 200k RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg • Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/Bit-Day (Typ) • Latch-Up Free Under Any Conditions • Military Temperature Range: -55°C to +125°C • Significant Power Reduction Compared to LSTTL ICs • DC Operating Voltage Range: 4.5V to 5.5V • Input Logic Levels •VIL = 30% of VCC Max •VIH = 70% of VCC Min • Input Current Levels Ii ≤ 5µA @ VOL, VOH Functional Diagram Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HCS32DMSR Q 5962R95 78101VCC -55°C to +125°C 14 Ld SBDIP D14.3 HCS32KMSR Q 5962R95 78101VXC -55°C to +125°C 14 Ld Ceramic Flatpack K14.A HCS32D/ Sample +25°C 14 Ld SBDIP HCS32K/ Sample +25°C 14 Ld Ceramic Flatpack HCS32HMSR +25°C Die Intersil Pb-free hermetic packaged products employ SnAgCu or Au termination finish, which are RoHS compliant termination finishes and compatible with both SnPb and Pb-free soldering operations. Ceramic dual in-line packaged products (CerDIPs) do contain lead (Pb) in the seal glass and die attach glass materials. However, lead in the glass materials of electronic components are currently exempted per the RoHS directive. Therefore, ceramic dual inline packages with Pb-free termination finish are considered to be RoHS compliant. TABLE 1. TRUTH TABLE INPUTS OUTPUTS An Bn Yn LLL LH H HLH HHH NOTE: L = Logic Level Low, H = Logic level High (1, 4, 9, 12) An (2, 5, 10, 13) Bn Yn (3, 6, 8, 11) Data Sheet April 11, 2007 |
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Similar Description - HCS32K |
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