Specifications of the HT1 MOA3 S30

Rev. 1.1

1997-08-19

Ht1moa3.doc/HS

Page 3 of 24

1 Definitions

1.1 Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 1 chip module

HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).

1.2 Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The

HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless

smart cards according to ISO 10536.1.

So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to

spend time with micro assembly and therefore start - e.g. ISO card production - with the

HITAG 1 chip module.

1.3 Use of the Modules

The HITAG 1 modules are designed to be connected to a coil and then to be further processed by

packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing

information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a

recess for the chip module in the card body.