Lead-free

DS30093 Rev. 13 - 2

1 of 3

BZT52C2V0S - BZT52C39S

www.diodes.com

·

Planar Die Construction

·

Ultra-Small Surface Mount Package

·

Ideally suited for Automated Assembly Processes

·

Lead Free/RoHS Compliant (Note 3)

·

Qualified to AEC-Q101 Standards for High Reliability

Features

Maximum Ratings

°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 2)

0.9

V

Power Dissipation (Note 1)

200

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

625

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration test pulse used in minimize self-heating effect.

3. No purposefully added lead.

Mechanical Data

BZT52C2V0S - BZT52C39S

SURFACE MOUNT ZENER DIODE

A

B

C

D

E

G

H

J

SOD-323

Dim

Min

Max

A

2.30

2.70

B

1.60

1.80

C

1.20

1.40

D

1.05 Typical

E

0.25

0.35

G

0.20

0.40

H

0.10

0.15

J

0.05 Typical

a

0

°

8

°

All Dimensions in mm

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Case: SOD-323

·

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

·

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminals: Solderable per MIL-STD-202, Method 208

·

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

·

Polarity: Cathode Band

·

Marking: See Sheet 2

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Weight: 0.004 grams (approximate)

SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S

BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S

BZT52C18S BZT52C20S BZT52C22S BZT52C24S BZT52C27S BZT52C30S BZT523C33S BZT52C36S BZT52C39S