11

FN3282.12

November 27, 2006

DG411, DG412, DG413

Thin Shrink Small Outline Plastic Packages (TSSOP)

NOTES:

1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AB, Issue E.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.15mm (0.006

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08mm (0.003 inch) total in excess

of “b” dimension at maximum material condition. Minimum space

between protrusion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are not necessarily exact. (Angles in degrees)

α

INDEX

AREA

E1

D

N

12

3

-B-

0.10(0.004)

C A

M

BS

e

-A-

b

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

c

E

0.25(0.010)

B

M

M

L

0.25

0.010

GAUGE

PLANE

A2

0.05(0.002)

M16.173

16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

-

0.043

-

1.10

-

A1

0.002

0.006

0.05

0.15

-

A2

0.033

0.037

0.85

0.95

-

b

0.0075

0.012

0.19

0.30

9

c

0.0035

0.008

0.09

0.20

-

D

0.193

0.201

4.90

5.10

3

E1

0.169

0.177

4.30

4.50

4

e

0.026 BSC

0.65 BSC

-

E

0.246

0.256

6.25

6.50

-

L

0.020

0.028

0.50

0.70

6

N16

16

7

a

-

Rev. 1 2/02