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HFA1105IB96 Datasheet(PDF) 11 Page - Intersil Corporation |
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HFA1105IB96 Datasheet(HTML) 11 Page - Intersil Corporation |
11 / 12 page 11 FN3395.8 June 6, 2006 Die Characteristics DIE DIMENSIONS: 59 mils x 59 mils x 19 mils 1500 µm x 1500µm x 483µm METALLIZATION: Type: Metal 1: AICu(2%)/TiW Thickness: Metal 1: 8k Å ±0.4kÅ Type: Metal 2: AICu(2%) Thickness: Metal 2: 16k Å ±0.8kÅ PASSIVATION: Type: Nitride Thickness: 4k Å ±0.5kÅ TRANSISTOR COUNT: 75 SUBSTRATE POTENTIAL (POWERED UP): Floating (Recommend Connection to V-) Metallization Mask Layout HFA1105 V- NC OUT +IN -IN V+ NC HFA1105 |
Similar Part No. - HFA1105IB96 |
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