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AM29LV641GH55WHI Datasheet(PDF) 5 Page - Advanced Micro Devices |
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AM29LV641GH55WHI Datasheet(HTML) 5 Page - Advanced Micro Devices |
5 / 55 page June 14, 2005 Am29LV641G 6 ADV ANCE I N FO RMAT I O N TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Package Handling Instructions .................................... 7 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations .....................................................10 VersatileI/O ™ (V IO) Control .................................................... 10 Requirements for Reading Array Data ................................... 10 Writing Commands/Command Sequences ............................ 11 Accelerated Program Operation ......................................................11 Autoselect Functions .......................................................................11 Standby Mode ........................................................................ 11 Automatic Sleep Mode ........................................................... 11 RESET#: Hardware Reset Pin ............................................... 11 Output Disable Mode .............................................................. 12 Table 2. Sector Address Table ........................................................12 Autoselect Mode ..................................................................... 16 Table 3. Autoselect Codes, (High Voltage Method) ......................16 Sector Group Protection and Unprotection ............................. 17 Table 4. Sector Group Protection/Unprotection Address Table .....17 Write Protect (WP#) ................................................................ 18 Temporary Sector Group Unprotect ....................................... 18 Figure 1. Temporary Sector Group Unprotect Operation................ 18 Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19 SecSi ™ (Secured Silicon) Sector Flash Memory Region ....... 20 Table 5. SecSi Sector Contents ......................................................20 Figure 3. SecSi Sector Protect Verify.............................................. 21 Hardware Data Protection ...................................................... 21 Low V CC Write Inhibit .......................................................................21 Write Pulse “Glitch” Protection ........................................................21 Logical Inhibit ..................................................................................21 Power-Up Write Inhibit ....................................................................21 Common Flash Memory Interface (CFI) . . . . . . . 21 Table 6. CFI Query Identification String .......................................... 22 Table 7. System Interface String..................................................... 22 Table 8. Device Geometry Definition .............................................. 22 Table 9. Primary Vendor-Specific Extended Query ........................ 24 Command Definitions . . . . . . . . . . . . . . . . . . . . . 24 Reading Array Data ................................................................ 24 Reset Command ..................................................................... 25 Autoselect Command Sequence ............................................ 25 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 25 Word Program Command Sequence ..................................... 25 Unlock Bypass Command Sequence ..............................................26 Figure 4. Program Operation .......................................................... 26 Chip Erase Command Sequence ........................................... 26 Sector Erase Command Sequence ........................................ 27 Erase Suspend/Erase Resume Commands ........................... 27 Figure 5. Erase Operation............................................................... 28 Command Definitions ............................................................. 29 Table 10. Command Definitions...................................................... 29 Write Operation Status . . . . . . . . . . . . . . . . . . . . . 30 DQ7: Data# Polling ................................................................. 30 Figure 6. Data# Polling Algorithm .................................................. 30 DQ6: Toggle Bit I .................................................................... 30 Figure 7. Toggle Bit Algorithm........................................................ 31 DQ2: Toggle Bit II ................................................................... 32 Reading Toggle Bits DQ6/DQ2 ............................................... 32 DQ5: Exceeded Timing Limits ................................................ 32 DQ3: Sector Erase Timer ....................................................... 32 Table 11. Write Operation Status ................................................... 33 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34 Figure 8. Maximum Negative Overshoot Waveform ..................... 34 Figure 9. Maximum Positive Overshoot Waveform ....................... 34 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 10. I CC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ........................................... 36 Figure 11. Typical I CC1 vs. Frequency ............................................ 36 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 12. Test Setup.................................................................... 37 Table 12. Test Specifications ......................................................... 37 Key to Switching Waveforms. . . . . . . . . . . . . . . . 37 Figure 13. Input Waveforms and Measurement Levels...................................................................... 37 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38 Read-Only Operations ........................................................... 38 Figure 14. Read Operation Timings ............................................... 38 Hardware Reset (RESET#) .................................................... 39 Figure 15. Reset Timings ............................................................... 39 Erase and Program Operations .............................................. 40 Figure 16. Program Operation Timings.......................................... 41 Figure 17. Accelerated Program Timing Diagram .......................... 41 Figure 18. Chip/Sector Erase Operation Timings .......................... 42 Figure 19. Data# Polling Timings (During Embedded Algorithms)...................................................... 43 Figure 20. Toggle Bit Timings (During Embedded Algorithms)...................................................... 44 Figure 21. DQ2 vs. DQ6................................................................. 44 Temporary Sector Unprotect .................................................. 45 Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 45 Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 46 Alternate CE# Controlled Erase and Program Operations ..... 47 Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings .............................................. 48 Erase And Programming Performance . . . . . . . 49 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49 TSOP & FBGA Pin Capacitance. . . . . . . . . . . . . . 49 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 11 x 12 mm package ................................................. 50 LAA064–64-Ball Fortified Ball Grid Array (Fortified BGA) 13 x 11 mm package ........................................................................... 51 TS 048—48-Pin Standard TSOP ............................................ 52 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53 |
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