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AP1506-12T5L Datasheet(PDF) 8 Page - Anachip Corp |
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AP1506-12T5L Datasheet(HTML) 8 Page - Anachip Corp |
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8 / 13 page  AP1506 150KHz, 3A PWM Buck DC/DC Converter Anachip Corp. www.anachip.com.tw Rev.1.3 Oct 24, 2005 8/13 Function Description Pin Functions +VIN This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be present at this pin to minimize voltage transients and to supply the switching currents needed by the regulator. Ground Circuit ground. Output Internal switch. The voltage at this pin switches between (+VIN – VSAT) and approximately – 0.5V, with a duty cycle of approximately VOUT / VIN. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be kept a minimum. Feedback (FB) Senses the regulated output voltage to complete the feedback loop. ON /OFF (SD) Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply current to approximately 150uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a maximum of 18V) shuts the regulator down. If this shutdown feature is not needed, the ON / OFF pin can be wired to the ground pin. Thermal Considerations The AP1506 is available in two packages: a 5-pin TO-220 and a 5-pin surface mount TO-263. The TO-220 package needs a heat sink under most conditions. The size of the heatsink depends on the input voltage, the output voltage, the load current and the ambient temperature. The AP1506 junction temperature rises above ambient temperature for a 3A load and different input and output voltages. The data for these curves was taken with the AP1506 (TO-220 package) operating as a buck-switching regulator in an ambient temperature of 25 oC (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking. The TO-263 surface mount package tab was designed to be soldering to the copper on a printed circuit board. The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.8 in 2, and ideally should have 2 or more square inches of 2 oz. Additional copper area improves the thermal characteristics, but with copper areas greater than approximately 6 in 2, only small improvements in heat dissipation are realized. If further thermal improvements are needed, double sided, multi-layer PC board with large copper areas and/or airflow will be recommended. The AP1506 (TO-263 package) junction temperature rises above ambient temperature with a 2A load for various input and output voltages. This data was taken with the circuit operating as a buck-switching regulator with all components mounted on a PC board to simulate the junction temperature under actual operating conditions. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load currents higher than 3A are used, double sided or multi-layer PC boards with large copper areas and/or airflow might be needed, especially for high ambient temperatures and high output voltages. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (Once exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. This Anachip version datasheet is replaced with Diodes Inc. datasheet AP1506 |
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