AD9236

Rev. B | Page 7 of 36

ABSOLUTE MAXIMUM RATINGS

Table 6.

THERMAL RESISTANCE

With

Respect to

Parameter

Min

Max

Unit

ELECTRICAL

is specified for the worst-case conditions on a 4-layer board

in still air, in accordance with EIA/JESD51-1.

AVDD

AGND

–0.3

+3.9

Table 7.

V

DRVDD

DGND

–0.3

+3.9

V

θ

θ

Package Type

Unit

JA

JC

AGND

DGND

–0.3

+0.3

V

RU-28

67.7

°C/W

AVDD

DRVDD

–3.9

+3.9

V

CP-32-2

32.5

32.71

°C/W

D0 to D11

DGND

–0.3

DRVDD + 0.3

V

CLK, MODE

AGND

–0.3

AVDD + 0.3

V

VIN+, VIN–

AGND

–0.3

AVDD + 0.3

Airflow increases heat dissipation effectively, reducing θ

V

JA

. In

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

reduces the θ

VREF

AGND

–0.3

AVDD + 0.3

V

SENSE

AGND

–0.3

AVDD + 0.3

V

REFT, REFB

AGND

–0.3

AVDD + 0.3

V

JA

. It is recommended that the exposed paddle be

soldered to the ground plane for the LFCSP package. There is

an increased reliability of the solder joints, and maximum

thermal capability of the package is achieved with the exposed

paddle soldered to the customer board.

PDWN

AGND

–0.3

AVDD + 0.3

V

ENVIRONMENTAL

Storage Temperature

–65

+125

°C

Operating Temperature Range

–40

+85

°C

300

°C

Lead Temperature

(Soldering 10 sec)

Junction Temperature

150

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.