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HI3026A Datasheet(PDF) 9 Page - Intersil Corporation

Part # HI3026A
Description  8-Bit, 140 MSPS, Flash A/D Converter
Download  17 Pages
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HI3026A Datasheet(HTML) 9 Page - Intersil Corporation

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9
Notes On Operation
• The HI3026A is a high-speed A/D converter which is capa-
ble of TTL, ECL and PECL level clock input. Characteristic
impedance should be properly matched to ensure opti-
mum performance during high-speed operation.
• The power supply and grounding have a profound
influence on converter performance. The power supply
and grounding method are particularly important during
high-speed operation. General points for caution are as
follows:
- The ground pattern should be as large as possible. It is
recommended to make the power supply and ground
patterns wider at an inner layer using a multi-layer board.
- To prevent interference between AGND and DGND and
between AVCC and DVCC, make sure the respective pat-
terns are separated. To prevent a DC offset in the power
supply pattern, connect the AVCC and DVCC lines at one
point each via a ferrite-bead filter. Shorting the AGND
and DGND patterns in one place immediately under the
A/D converter improves A/D converter performance.
- Ground the power supply pins (AVCC, DVCC1, DVCC2,
DVEE3) as close to each pin as possible with a 0.1µF or
larger ceramic chip capacitor. (Connect the AVCC pin to
the AGND pattern and the DVCC1, DVCC2, DVEE3 pins
to the DGND pattern.)
- The digital output wiring should be as short as possible.
If the digital output wiring is long, the wiring capacitance
will increase, deteriorating the output slew rate and
resulting in reflection to the output waveform since the
original output slew rate is quite fast.
• The analog input pin VIN has an input capacitance of
approximately 21pF. To drive the A/D converter with proper
frequency response, it is necessary to prevent perfor-
mance deterioration due to parasitic capacitance or para-
sitic inductance by using a large capacity drive circuit,
keeping wiring as short as possible, and using chip parts
for resistors and capacitors, etc.
•The VRT and VRB pins must have adequate bypass to pro-
tect them from high-frequency noise. Bypass them to
AGND with approximately 1
µF tantal capacitor and, 0.1µF
capacitor as short as possible.
• When the digital input level is ECL or PECL level, ***/E
pins should be used and ***/T pins left open. When the
digital input level is TTL, ***/T pins should be used and
III/E pins left open.
TABLE 1. A/D CODE TABLE
VIN
STEP
INV
10
D7
D0
D7
D0
VRT
255
1111111100000000
254
1111111000000001
VRM2
128
1000000001111111
127
0111111110000000
1
0000000111111110
VRB
0
0000000011111111
Test Circuits
FIGURE 4. CURRENT CONSUMPTION MEASUREMENT
CIRCUIT
FIGURE 5. INTEGRAL LINEARITY ERROR/DIFFERENTIAL
LINEARITY ERROR MEASUREMENT CIRCUIT
VRT
VIN
VRB
AVCC
DVCC1
DVCC2
DGND2
DGND1
AGND
DGND3
CLK/E
DVEE3
4V
1.95V
2V
5MHz PECL
A
A
5V
5V
ICC
IEE
A < B A > B
COMPARATOR
A8
TO
A1
B8
TO
B1
B0
A0
HI3026A
BUFFER
CONTROLLER
DVM
000...00
TO
111..10
VIN
8
“0”
8
“1”
-V
+V
S2
S1: ON WHEN A < B
S2: ON WHEN A > B
S1
+
-
HI3026A


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