Philips Semiconductors Linear Products

Product specification

NE/SA5090

Addressable relay driver

August 31, 1994

515

SWITCHING CHARACTERISTICS

SYMBOL

PARAMETER

TO

FROM

MIN

TYP

MAX

UNIT

Propagation delay time

Output

CE

900

1800

ns

130

260

920

1850

Output

Data

ns

130

260

900

1800

Output

Address

ns

130

260

920

1850

Output

CLR

ns

Switching setup requirements

Setup time high

Setup time low

Chip enable

Chip enable

High data

Low data

40

50

ns

Address setup time

Chip enable

Address

40

ns

Hold time high

Hold time low

Chip enable

Chip enable

High data

Low data

10

10

ns

40

ns

NOTES:

1. See Turn-On and Turn-Off Delays, Enable-to-Output and Enable Pulse Width timing diagram.

2. See Turn-On and Turn-Off Delays, Data-to-Output timing diagram.

3. See Turn-On and Turn-Off Delays, Address-to-Output timing diagram.

4. See Turn-Off Delay, Clear-to-Output timing diagram.

5. See Setup and Hold Time, Data-to-Enable timing diagram.

6. See Setup Time, Address-to-Enable timing diagram.

FUNCTIONAL DESCRIPTION

This peripheral driver has latched outputs which hold the input date

until cleared. The NE5090 has active-Low, open-collector outputs,

all of which are cleared when power is first applied. This device is

identical to the NE590, except the outputs can withstand 28V.

Addressable Latch Function

Any given output can be turned on or off by presenting the address

of the output to be set or cleared to the three address pins, by

holding the “D” input High to turn on the selected output, or by

holding it Low to turn off, holding the CLR input High, and bringing

the CE input Low. Once an output is turned on or off, it will remain

so until addressed again, or until all outputs are cleared by bringing

the CLR input Low while holding the CE input High.

Demultiplexer Operation

By holding the CLR and CE inputs Low and the ”D“ input High, the

addressed output will remain on and all other outputs will be off.

High Current Outputs

The obvious advantage of this device over other drivers such as the

9334 and N74LS259 is the fact that the outputs of the NE5090 are

each capable of 200mA and 28V. It must be noted, however, that the

total power dissipation would be over 2.5W if all 8 outputs were on

together and carrying 200mA each. Since the total power dissipation

is limited by the package to 1W, and since power dissipation due to

supply current is 0.25W, the total load power dissipation by the

device is limited to 0.75W at room temperature, and decreases as

ambient temperature rises.

The maximum die junction temperature must be limited to 165

°C,

and the temperature rise above ambient and the junction

temperature are defined as:

where

For example, if we are using the NE5090 in a plastic package in an

application where the ambient temperature is never expected to rise

above 50

°C, and the output current at the 8 outputs, when on, are

100, 40, 50, 200, 15, 30, 80, and 10mA, we find from the graph of

output voltage vs load current that the output voltages are expected

to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4V,

respectively. Total device power due to these loads is found to be

473.5mW. Adding the 200mW due to the power supply brings total

device power dissipation to 723.5mW. The thermal resistances are

83

°C,per W for plastic packages and 100°C per W for Cerdips.

Using the equations above we find:

maximum and either package could be used in this application. The

graphs of total load power vs ambient temperature would also give

us this same information, although interpreting the graphs would not

yield the same accuracy.