2.0-6.0 GHz

GaAs MMIC Amplifier

Page 2 of 5

CMM-5-BD

Specifications (T

Die Attach and Bonding Procedures

Bonding Diagram

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

January 2007 - Rev 15-Jan-07

Die Attach: Conductive epoxy or preform die attach is recom-

mended. For preform die attach: Preform: AuSn (80% Au, 20%

Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool:Tweezers;

Time: 1 min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-

stressed); Thermocompression bonding is preferred over

thermosonic bonding. For thermocompression bonding: Stage

Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding

Tip Pressure: 18 to 40 gms depending on size of wire.