11

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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

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For information regarding Intersil Corporation and its products, see www.intersil.com

FN6190.0

November 3, 2005

ISL84684II

Wafer Level Chip Scale Package (WLCSP)

PIN 1 ID

A

E1

SD

BOTTOM VIEW

A

B

12

C

SE

3

4

b

e

D1

SIDE VIEW

A1

b

A2

TOP VIEW

bb

D

E

W4x3.10A

4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE

SYMBOL

MILLIMETERS

NOTES

A

0.64 +0.05 -0.10

-

A1

0.29 ±0.02

-

A2

0.35 REF.

-

b

θ 0.37 ±0.03

-

bb

θ 0.30 REF.

-

D

1.50 ±0.05

-

D1

1.00 BASIC

-

E

2.00 ±0.05

-

E1

1.50 BASIC

-

e

0.50 BASIC

-

SD

0.00 BASIC

-

SE

0.25 BASIC

-

N10

3

Rev. 1 10/05

NOTES:

1. Dimensions are in Millimeters.

2. Dimensioning and tolerancing conform to ASME 14.5M-1994.

3. Symbol “N” is the actual number of solder balls.