7

FN6395.0

November 22, 2006

the bootstrap capacitor when exposed to excessively large

negative voltage swing at the PHASE node. Typically, such

large negative excursions occur in high current applications

parasitic inductance. The following equation helps select a

proper bootstrap capacitor size:

control MOSFETs. The

allowable droop in the rail of the upper gate drive.

As an example, suppose two HAT2168 FETs are chosen as

will assume a 100mV droop in drive voltage over the PWM

cycle. We find that a bootstrap capacitance of at least

0.264

μF is required. The next larger standard value

capacitance is 0.33µF. A good quality ceramic capacitor is

recommended.

Power Dissipation

Package power dissipation is mainly a function of the

external gate resistance, and the selected MOSFET’s

internal gate resistance and total gate charge. Calculating

the power dissipation in the driver for a desired application is

critical to ensure safe operation. Exceeding the maximum

allowable power dissipation level will push the IC beyond the

maximum recommended operating junction temperature of

+125°C. The maximum allowable IC power dissipation for

the SO14 package is approximately 1W at room

temperature, while the power dissipation capacity in the

QFN packages, with an exposed heat escape pad, is around

2W. See Layout Considerations paragraph for thermal

transfer improvement suggestions. When designing the

driver into an application, it is recommended that the

following calculation is used to ensure safe operation at the

desired frequency for the selected MOSFETs. The total gate

drive power losses due to the gate charge of MOSFETs and

the driver’s internal circuitry and their corresponding average

driver current can be estimated with Equations 2 and 3,

respectively,

quiescent current with no load at both drive outputs and can

MOSFETs, respectively. The factor 2 is the number of active

driver without capacitive load and is typically negligible.

The total gate drive power losses are dissipated among the

resistive components along the transition path. The drive

resistance dissipates a portion of the total gate drive power

losses, the rest will be dissipated by the external gate

interfering with the operation shoot-through protection

MOSFETs. Figures 3 and 4 show the typical upper and lower

gate drives turn-on transition path. The power dissipation on

the driver can be roughly estimated as:

C

BOOT_CAP

Q

GATE

ΔV

BOOT_CAP

--------------------------------------

≥

Q

GATE

Q

G1

PVCC

•

V

GS1

------------------------------------

N

Q1

•

=

(EQ. 1)

50nC

20nC

FIGURE 2. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE

VOLTAGE

ΔV

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.3

0.0

0.1

0.2

0.4

0.5

0.6

0.9

0.7

0.8

1.0

1.8

2.0

(EQ. 2)

P

Qg_Q1

Q

G1

•

V

GS1

---------------------------------------

F

SW

•

N

Q1

•

=

P

Qg_Q2

Q

G2

•

V

GS2

---------------------------------------

F

SW

•

N

Q2

•

=

P

Qg_TOT

2P

Qg_Q1

P

Qg_Q2

+

()

•

I

Q

VCC

•

+

=

(EQ. 3)

I

DR

2

Q

G1

N

Q1

•

V

GS1

------------------------------

Q

G2

N

Q2

•

V

GS2

------------------------------

+

⎝⎠

⎜⎟

⎛⎞

•

F

SW

I

Q

+

•

=

(EQ. 4)

P

DR_UP

R

HI1

R

HI1

R

EXT1

+

--------------------------------------

R

LO1

R

LO1

R

EXT1

+

----------------------------------------

+

⎝⎠

⎜⎟

⎛⎞ P

Qg_Q1

2

---------------------

•

=

P

DR_LOW

R

HI2

R

HI2

R

EXT2

+

--------------------------------------

R

LO2

R

LO2

R

EXT2

+

----------------------------------------

+

⎝⎠

⎜⎟

⎛⎞ P

Qg_Q2

2

---------------------

•

=

R

EXT2

R

G1

R

GI1

N

Q1

-------------

+

=

R

EXT2

R

G2

R

GI2

N

Q2

-------------

+

=

P

DR

2P

DR_UP

P

DR_LOW

+

()

•

I

Q

VCC

•

+

=

ISL6610, ISL6610A