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| ISL9212B |
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INTERSIL |
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2 page
2 FN6399.0 March 21, 2007 Absolute Maximum Ratings (Reference to GND) Thermal Information Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 30V Output and VB Pin (OUT, VB) (Note 1) . . . . . . . . . . . . . . . -0.3 to 7V Other Pins (ILIM, WRN, EN) . . . . . . . . . . . . . . . . . . . . . -0.3 to 5.5V Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3V to 6.5V Operating Current Range. . . . . . . . . . . . . . . . . . . . . . . . . . 0A to 2A Thermal Resistance (Notes 2, 3) θJA (°C/W) θJC (°C/W) 4x3 TDFN Package . . . . . . . . . . . . . . . 41 3.5 Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. +150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +150°C junction may trigger the shutdown of the device even before +150°C, since this number is specified as typical. ΝΟΤΕΣ: 1. The maximum voltage rating for the VB pin under continuous operating conditions is 5.5V. All other pins are allowed to operate continuously at the absolute maximum ratings. 2. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 3. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications Typical values are tested at VIN = 5V and +25°C Ambient Temperature, maximum and minimum values are guaranteed over the recommended operating conditions, unless otherwise noted. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS POWER-ON RESET Rising VIN Threshold VPOR 2.40 2.58 2.70 V POR Hysteresis - 100 - mV VIN Bias Current IVIN When enabled 0.75 0.90 1.10 mA VIN Bias Current When disabled 30 60 100 μA PROTECTIONS Input Overvoltage Protection (OVP) VOVP 6.65 6.80 7.00 V Input OVP Hysteresis - 60 100 mV Input OVP Falling Threshold 6.55 - - V Input OVP Propagation Delay -- 1 μs Overcurrent Protection IOCP VVB = 3V, RILIM = 25kΩ 0.93 1.00 1.07 A Overcurrent Protection Blanking Time BTOCP - 170 - μs Battery Overvoltage Protection Threshold VBOVP 4.28 4.34 4.40 V Battery OVP Threshold Hysteresis -30- mV Battery OVP Falling Threshold 4.25 - - V Battery OVP Blanking Time BTBOVP - 180 - μs VB Pin Leakage Current VVB = 4.34V - - 20 nA Over-Temperature Protection Rising Threshold - 140 - °C Over-Temperature Protection Falling Threshold - 90 - °C LOGIC EN Input Logic HIGH 1.5 - - V EN Input Logic LOW -- 0.4 V EN Internal Pull Down Resistor 100 200 400 k Ω WRN Output Logic Low Sink 5mA current - 0.35 0.80 V WRN Output Logic High Leakage Current - - 1 μA POWER MOSFET ON-Resistance rDS(ON) 4.6V < VIN < 6.5V - 170 280 m Ω ISL9212B |
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