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EL7566AIREZ Datasheet(PDF) 7 Page - Intersil Corporation |
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EL7566AIREZ Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 14 page 7 FN7102.7 May 8, 2006 FIGURE 7. FS vs LOAD CURRENT FIGURE 8. LOAD REGULATIONS FIGURE 9. HTSSOP THERMAL RESISTANCE vs PCB AREA (NO AIR FLOW) FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves VIN = VD = 5V, VO = 2.5V, IO = 6A, fS = 500kHz, L = 2.7µH, CIN = 100µF, COUT = 150µF, TA = 25°C unless otherwise noted. (Continued) 526 508 506 504 024 6 IO (A) 520 VIN=3.3V VIN=5V 512 516 135 524 518 510 514 522 0.1 -0.25 -0.3 -0.35 02 46 IO (A) 0 -0.15 135 -0.05 -0.2 -0.1 0.05 50 45 40 35 30 25 12 34567 89 PCB AREA (in2) CONDITION: 28-Pin HTSSOP THERMAL PAD SOLDERED TO 2-LAYER PCB WITH 0.039" THICKNESS AND 1 OZ. COPPER ON BOTH SIDES JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 3.5 2.5 2.0 1.0 0.5 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 1.5 3.0 1.00 0.90 0.30 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 85 0.70 0.20 0.50 125 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.10 0.40 0.60 0.80 EL7566 |
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