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EL5173IS-T7 Datasheet(PDF) 9 Page - Intersil Corporation |
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EL5173IS-T7 Datasheet(HTML) 9 Page - Intersil Corporation |
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9 / 14 page  9 FN7312.5 January 25, 2006 FIGURE 19. DISABLED RESPONSE FIGURE 20. ENABLED RESPONSE FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves (Continued) 1.136W θJA=88°C/W QSOP24 1.4 1.2 1 0.8 0.6 0.2 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 909mW θJA=110°C/W SO8 870mW θJA=115°C/W MSOP8/10 486mW θJA=206°C/W MSOP8 870mW θJA=115°C/W QSOP24 1.2 1 0.8 0.6 0.4 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 625mW θJA=160°C/W SO8 EL5173, EL5373 |
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