FDG6303N datasheet(2/5 Pages) FAIRCHILD

Part #	FDG6303N

Description	Dual N-Channel, Digital FET

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Manufacturer	FAIRCHILD [Fairchild Semiconductor]

Direct Link	http://www.fairchildsemi.com

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2 / 5 page

Electrical Characteristics (T

A = 25

OC unless otherwise noted )

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OFF CHARACTERISTICS

BV

DSS

Drain-Source Breakdown Voltage

V

GS = 0 V, ID = 250 µA

25

V

∆BV

DSS/∆TJ

Breakdown Voltage Temp. Coefficient

I

D = 250 µA, Referenced to 25

oC

26

mV/

oC

I

DSS

Zero Gate Voltage Drain Current

V

DS = 20 V, VGS = 0 V

1

µA

T

J = 55°C

10

µA

I

GSS

Gate - Body Leakage Current

V

GS = 8 V, VDS = 0 V

100

nA

ON CHARACTERISTICS (Note 2)

V

GS(th)

Gate Threshold Voltage

V

DS = VGS, ID = 250 µA

0.65

0.8

1.5

V

∆V

GS(th)/∆TJ

Gate Threshold Voltage Temp.Coefficient

I

D = 250 µA, Referenced to 25

oC

-2.6

mV/

oC

R

DS(ON)

Static Drain-Source On-Resistance

V

GS = 4.5 V, ID = 0.5 A

0.34

0.45

Ω

T

J =125°C

0.55

0.77

V

GS = 2.7 V, ID = 0.2 A

0.44

0.6

I

D(ON)

On-State Drain Current

V

GS = 2.7 V, VDS = 5 V

0.5

A

g

FS

Forward Transconductance

V

DS = 5 V, ID = 0.5 A

1.45

S

DYNAMIC CHARACTERISTICS

C

iss

Input Capacitance

V

DS = 10 V, VGS = 0 V,

f = 1.0 MHz

50

pF

C

oss

Output Capacitance

28

pF

C

rss

Reverse Transfer Capacitance

9

pF

SWITCHING CHARACTERISTICS (Note 2)

t

D(on)

Turn - On Delay Time

V

DD = 5 V, ID = 0.5 A,

V

GS = 4.5 V, RGEN = 50 Ω

3

6

ns

t

r

Turn - On Rise Time

8.5

18

ns

t

D(off)

Turn - Off Delay Time

17

30

ns

t

f

Turn - Off Fall Time

13

25

ns

Q

g

Total Gate Charge

V

DS = 5 V, ID = 0.5 A,

V

GS = 4.5 V

1.64

2.3

nC

Q

gs

Gate-Source Charge

0.38

nC

Q

gd

Gate-Drain Charge

0.45

nC

DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS

I

S

Maximum Continuous Source Current

0.25

A

V

SD

Drain-Source Diode Forward Voltage

V

GS = 0 V, IS = 0.25 A (Note 2)

0.8

1.2

V

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed

by design while RθCA is determined by the user's board design. RθJA = 415

OC/W on minimum pad mounting on FR-4 board in still air.

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

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